Review



back grinding tape laminator  (LINTEC Corporation)

 
  • Logo
  • About
  • News
  • Press Release
  • Team
  • Advisors
  • Partners
  • Contact
  • Bioz Stars
  • Bioz vStars
    • 90
      Buy from Supplier

    Structured Review

    LINTEC Corporation back grinding tape laminator
    Back Grinding Tape Laminator, supplied by LINTEC Corporation, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
    https://www.bioz.com/product/back+grinding+tape+laminator/rad+3510f+12/us11942353-374-43-50
    Average 90 stars, based on 1 article reviews
    back grinding tape laminator - by Bioz Stars, 2026-09
    90/100 stars

    Images

    Related Articles

    Adhesive:

    Article Title: Semiconductor processing adhesive tape and method of manufacturing semiconductor device
    Article Snippet: .. [Evaluation of Tape Debris] A semiconductor processing adhesive tape produced in Examples 1 to 6 and Comparative examples 1 and 2 was adhered to a silicon wafer having a diameter of 12 inch and a thickness of 775 μm using a back grinding tape laminator (product name: “RAD-3510F/12” made by Lintec Corporation) and then the semiconductor processing adhesive tape was cut along an outer circumference of the silicon wafer. ..

    Article Title: Adhesive tape for semiconductor processing and method for producing semiconductor device
    Article Snippet: .. [Evaluation of Tape Debris] A semiconductor processing adhesive tape produced in Examples 1 to 5 and Comparative examples 1 to 4 was adhered to a silicon wafer having a diameter of 12 inch and a thickness of 775 μm using a back grinding tape laminator (product name: “RAD-3510F/12” made by Lintec Corporation) and then the semiconductor processing adhesive tape was cut along an outer circumference of the silicon wafer. ..

    Produced:

    Article Title: Semiconductor processing adhesive tape and method of manufacturing semiconductor device
    Article Snippet: .. [Evaluation of Tape Debris] A semiconductor processing adhesive tape produced in Examples 1 to 6 and Comparative examples 1 and 2 was adhered to a silicon wafer having a diameter of 12 inch and a thickness of 775 μm using a back grinding tape laminator (product name: “RAD-3510F/12” made by Lintec Corporation) and then the semiconductor processing adhesive tape was cut along an outer circumference of the silicon wafer. ..

    Article Title: Adhesive tape for semiconductor processing and method for producing semiconductor device
    Article Snippet: .. [Evaluation of Tape Debris] A semiconductor processing adhesive tape produced in Examples 1 to 5 and Comparative examples 1 to 4 was adhered to a silicon wafer having a diameter of 12 inch and a thickness of 775 μm using a back grinding tape laminator (product name: “RAD-3510F/12” made by Lintec Corporation) and then the semiconductor processing adhesive tape was cut along an outer circumference of the silicon wafer. ..



    Similar Products

    back grinding tape laminator  (LINTEC Corporation)
    90
    LINTEC Corporation back grinding tape laminator
    Back Grinding Tape Laminator, supplied by LINTEC Corporation, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
    https://www.bioz.com/product/back+grinding+tape+laminator/rad+3510f+12/us11942353-374-43-50
    Average 90 stars, based on 1 article reviews
    back grinding tape laminator - by Bioz Stars, 2026-09
    90/100 stars
    		  Buy from Supplier

    Image Search Results